XHSC Semiconductor Components on ICGOODFIND SiteMap
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- TSMC to Hike Mature-Node Wafer Prices – First Adjustment in 3 Years
- China’s AI Hardware Trade Hits RMB 5.13 Trillion in H1 2026 – Up 56.6% YoY
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- AMD Confirms Zen 6 Launch at Advancing AI 2026 – July 22-23
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- Lithium Battery and Radar Pioneers Win China’s Top Science Award
- Samsung Lands Neuralink Chip Order – Expands Musk Partnership into Biochips
- onsemi NCV8406ASTT1G: A Comprehensive Overview of the Protected Low-Side MOSFET Power Switch
- onsemi MM3Z12VT1G: 12V Zener Voltage Regulator Diode for Circuit Protection and Voltage Stabilization
- Onsemi MMSZ5226BT1G Zener Diode: Key Features, Applications, and Technical Specifications
- Onsemi FDV302P P-Channel Enhancement Mode MOSFET Datasheet and Application Circuit Design Guide
- onsemi NCP114AMX180TCG: 8V, 3A Low-IQ Low-Dropout Voltage Regulator for High-Performance Portable Applications
- onsemi NCP5501DT50RKG 50 mA Low-Dropout Voltage Regulator: Datasheet, Pinout, and Application Circuits
- Designing a Robust Quasi-Resonant Flyback Converter with onsemi NCP1380DDR2G
- onsemi MC14011BDTR2G Quad 2-Input NAND Gate: Datasheet, Pinout, and Application Circuit Guide
- Kioxia & SanDisk Ship BiCS10 332-Layer 3D NAND Samples – 59% Density Jump
- onsemi NLSX4378ABFCT1G Dual-Supply Level Translator: Features and Applications
- Onsemi NSV50150ADT4G: Ultra-Low VCE(sat) Bipolar Transistor for High-Efficiency Power Switching
- Optimizing LED Driver Performance with the onsemi NCP5623DTBR2G Triple-Output I²C Controller
- Onsemi MOC3041SR2M Zero-Crossing Triac Driver Optocoupler: Features and Application Circuits
- onsemi BC817-40LT1G SOT-23 General Purpose NPN Transistor: Key Specifications and Application Circuit Design
- High-Performance LIN Bus Transceiver: onsemi NCV7321D12R2G for Robust Automotive Networking
- High-Performance 20 W Adapter Design Using the onsemi NCP1252EDR2G Fixed-Frequency PWM Current-Mode Controller
- Automotive Relay Driver Solution with the onsemi NUD3124LT1G
- ZTE Microelectronics Invests RMB 100M to Establish Nanjing Semiconductor Subsidiary
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Etched Solves AI Throttling with Low-Voltage Design – SRAM+HBM, 80%+ Utilization on Sparse MoE
- Tata Electronics Hit by 630GB Cyber Breach – Apple & Tesla Blueprints Dumped on Dark Web
- onsemi to Acquire Synaptics in $7B All‑Stock Deal, Expanding Edge AI Footprint
- TI Launches Integrated GaN Buck‑Boost Converters for High‑Power Density
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- China’s Largest Automotive Chip Test Center Launches in Shanghai Lingang
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- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- NXP’s SAF8444 Single‑Chip Radar Brings ADAS to Entry‑Level EVs
- Li Auto’s Mach M100 Dataflow Chip Hits 1280 TOPS, Outperforms Nvidia ThorU
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
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- China GPU ‘Four Dragons’ Member Enflame Nears STAR Market IPO Hearing, Targets $825M Raise
- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- Shenzhen University Launches Integrated Circuit School to Boost Chip Talent Pipeline
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Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP BZT52H-C7V5 Zener Diode: Key Features and Application Circuit Design Considerations
- NXP BTA316-600B: A Comprehensive Technical Overview of the 600V High-Side Switch
- The NXP MC56F82746VLF: A Hybrid DSC for Advanced Digital Power and Motor Control Applications
- NXP BYC8-600: A High-Performance 600V Rectifier for Demanding Power Applications
- NXP 2N7002E: A Comprehensive Technical Overview and Application Guide for the Industry-Standard Small-Signal MOSFET
- NX5DV715HF: NXP's High-Performance Dual-Band WLAN Coexistence Filter for Next-Generation Connectivity
- NXP 74LVC3G07DP: A Comprehensive Guide to the Triple Buffer/Driver with Open-Drain Outputs
- NXP PCA9673BS: A Comprehensive Technical Overview of the 16-bit I2C-bus and SMBus I/O Expander
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- NXP PMEG4010EH: A Comprehensive Technical Overview of its Features and Applications
- NXP 74LVC2G66DP: A Comprehensive Technical Overview of the Dual Single-Pole Single-Throw Analog Switch
- NXP 74LVC244ADB: Octal Buffer/Line Driver with 3-State Outputs and 5V Tolerant Inputs
- NXP BAP64-05: A Comprehensive Technical Overview of the Silicon PIN Diode
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP 74HCT164D: An 8-Bit Serial-In Parallel-Out Shift Register for Digital Logic Design
- NXP QN9021/DY: A Comprehensive Overview of the Ultra-Low Power Bluetooth Low Energy SoC
- NXP PSMN4R2-30MLD: A High-Performance 40V MOSFET for Demanding Power Conversion Applications
- NXP 74LVC126APW: A Comprehensive Technical Overview of the Quad Buffer IC
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More
- ams OSRAM Sells CMOS Image Sensor Business to indie Semiconductor for €40M
- US Reveals $2.5B Nvidia GPU Smuggling Ring: Bangkok’s OBON Named as ‘Company-1’
- NXP LPC1778FET180,551: A Comprehensive Technical Overview and Application Guide
- NXP BZX384-C3V0: A Comprehensive Technical Overview of the 0V Voltage Reference Zener Diode
- NXP LS1046AXN8P1A: A High-Performance Networking Processor for Advanced Embedded Applications
- NXP MC32PF3001A7EP: A Comprehensive Technical Overview of the Advanced Power Management IC
- LPC5516JBD100E: NXP's 100-LQFP Arm Cortex-M33-Based Microcontroller for Secure and Efficient Embedded Processing
- NXP MCF51AC128CCFUE: A Comprehensive Technical Overview of the ColdFire V1 Embedded Microcontroller
- NXP MC33PF8100CFES: A Comprehensive System Basis Chip for Next-Generation Automotive Applications
- NXP LS1043ASE7QQB: A High-Performance Quad-Core Communication Processor for Embedded Networking and Industrial Applications
- Sunlord’s AI Inductors Enter Mass Production, Tantalum Caps Ramp Up in eSSD and Data Centers
- Murata to Invest ¥80 Billion in MLCC Expansion, Targets Data Center Demand
- India Approves Two New Semiconductor Projects – Enters GaN Foundry Race
- Apple Courts Intel & Samsung for Chip Foundry as Samsung Hits $1 Trillion
- NXP BAS31: A Comprehensive Technical Overview of the High-Speed Switching Diode
- NXP LPC2214FBD144/01: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- High-Efficiency, Standalone LLC Resonant Controller with Integrated PFC Drive: Exploring the NXP TEA1995T/1J
- NXP MC908MR32CFUE: Technical Overview and Application Note for a Legacy 8-bit Microcontroller